Low Temperature Co-fired Ceramic
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Low Temperature Co-fired Ceramic

Low Temperature Co-fired Ceramic em i wanpela gutpela ilektronik seramik samting we ol i wokim long rot bilong 'ceramic green tape casting', 'conductor circuit printing', 'multilayer lamination', na 'single co-firing long tempereja aninit long 900 digri.
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Teknikel Paramita

Prodak Introdaksen

 

Low Temperature Co-fired Ceramic em i wanpela gutpela ilektronik seramik samting we ol i wokim long rot bilong 'ceramic green tape casting', 'conductor circuit printing', 'multilayer lamination', na 'single co-firing long tempereja aninit long 900 digri.

 

Ol bikpela gutpela samting

 

Liklik Dielektrik Lus
LTCC i gat liklik 'dielectric constant' na 'dielectric loss', na dispela i save daunim tru 'high-frequency signal atenuation na crosstalk, na i save mekim signal i kamap gutpela moa.

Strongpela Multilayer Integresen Kepabiliti
LTCC i sapotim wok bilong putim ol 'resistor', 'capacitor', 'inductor', na ol 'complex conductor lines', na dispela i mekim na ol i ken wokim tripela 'dimensional circuit'.

Gutpela 'Thermal Stability'
Dispela samting i gat liklik 'coefficient' bilong 'thermal expansion' na gutpela 'dimensional stability', na dispela i larim em long sanap strong longpela taim long 'high' na 'low tempereture cycling'.

 

LTCC egensim ol narapela samting

 

Banis

LTCC

HTCC

PCB

Tempereja bilong paia

<900 digri

>1600 digri

-

Hai Frikwensi Pefomens

Nambawan

Gutpela

I no bikpela

Dielectric Loss

Daunbilo

Midium

Hai

Stap bilong hat

Nambawan

Nambawan

I no bikpela

Miniaturisesen

Nambawan

Gutpela

Limited

Ol Komponen we i stap insait

Yes

Limited

Nogat

Signal Integrity

Nambawan

Gutpela

I no bikpela

 

Teknikel Spesifikasen

 

Samting

Tipikel veliu

Kain samting

LTCC Seramik

Dielectric Constant (Dk)

5.5–10

Dielectric Loss (tanδ)

0.001–0.003

Thermal Conductivity

3–5 W/m·K

CTE

5.8–7.2 ×10⁻⁶/K

Kaun bilong ol leia

I go inap long 40+ Leya

Min. Lain Width/Spesing

Liklik o wankain olsem 50 μm / 50 μm

Min. Long rot bilong Diamita

Bikpela o wankain olsem 75 μm

Metalisasen

Ag / Au / Cu

Strong bilong tanim

Bikpela o wankain olsem 230 MPa

Tempereja bilong wok

-65 digri i go long +250 digri

Raf bilong pes

Liklik o wankain olsem 0.3 μm

Ol sais

Kastom

 

Ol sevis bilong stretim ol samting

 

Material System Customization:Sapotim disain bilong ol samting wantaim ol narapela narapela 'dielectric constants', 'thermal conductivity', na 'coefficients of thermal expansion'.

Multilayer Stracture Customization:Sapotim divelopmen bilong ol kain kain namba bilong ol leia, tiknes, na ol kompleks 3D waia straksa.

Metalisasen Solusen Kastomaisesen:Em i save givim ol 'conductor' sistem olsem Ag, Au, na Cu, na tu ol rot bilong stretim 'surface'.

RF Pefomens Optimaisesen:Kolaboretiv disain we i kamap long operesen frikwensi, ol lus rikwaemen, na aplikesen envairomen.

OEM/ODM Divelopmen:Sapotim wanpela-stop sevis stat long makim ol samting, disain bilong straksa, divelopmen bilong sampela samting i go inap long kamapim planti samting.

 

Ol aplikesen

 

5G Komyunikesen:Ol i save yusim long ol 'base station antennas', RF fran-en, na ol milimita-wev komunikesen modul.

Reda bilong ol kar:Ol i yusim long 77GHz otomotiv milimita-wev reda paket na antena sistem.

Ol GPS Antena:Ol i save yusim long 'navigation', 'positioning', na ol samting bilong toktok long satelit.

IoT Divais:Em i gutpela long ol 'wireless communication terminals' we i gat planti 'integrated'.

Aerospace Electronics:I inapim ol samting we ol i laikim long ol 'high-reliability aerospace electronic systems.

Ol Indastrial Sensa:Em i gutpela long ol indastriel otomesen na ol gutpela sensing sistem.

 

Kwaliti Asurens

 

Sekim ol Raw Material:Ol i save mekim strongpela wok painimaut long 'purity', sais bilong ol liklik hap samting, na ol bikpela samting bilong ol 'raw materials'.

Proses Kwaliti Kontrol:Ol i save mekim 'online monitoring' na 'data traceability' long ol bikpela wok bilong mekim wok i stap gut.

Verifikasen bilong gutpela bilong prodak i pinis:Ol i save mekim 'dielectric performance', 'high' na low temperature cycling', 'thermal shock', 'X-ray', na 'airtightness testing' bilong lukim olsem prodak i wok gut longpela taim.

 

Strong bilong kampani

 

20+ Yia Ekspiriens long Wokim Samting
Ol i bin kirapim long 2003, na ol i save wok long R&D na wokim ol nupela samting we i no gat laip, na ol i gat moa long 20 yia ekspiriens long indastri.

Stebol Prodaksen Kapabiliti
I gat bikpela-skel prodaksen beis na wanpela gutpela sistem bilong wokim ol samting, na i sapotim longpela taim stebol prokiumen long ol global klaien.

Profesenel R&D Tim
I gat ol samting bilong R&D na wok bilong mekim gutpela wok, na i givim ol gutpela rot bilong stretim hevi.

Strongpela Kwaliti Kontrol
I gat ol gutpela masin bilong testim, na i bosim gut kwaliti bilong prodak na stebiliti bilong ol samting.

Global Ekspot Ekspiriens
Ol i save salim ol prodak i go long ol ovasis maket, wantaim ol gutpela sevis bilong salim ol samting i go aut na ol gutpela rot bilong sapotim ol kastoma.

Ol Solusen we ol i wokim long laik bilong ol yet
Sapotim wok bilong stretim ol spesifikasen bilong prodak, pefomens, na ol aplikesen rikwaemen bilong inapim ol kain kain nid bilong ol kastoma.

 

FAQ

 

Q: Wanem samting i narapela long LTCC na HTCC?

A: LTCC i gat liklik 'sintering temperature', em inap long yusim ol 'highly conductive metal systems', na em i gat gutpela 'high-frequency performance.

Q: Wanem ol metalisasen skim ol i sapotim?

A: Ag, Au, Cu, na ol narapela kondukta sistem i stap.

Q: Yu ken givim ol kastom disain?

A: Yu ken stretim ol samting, namba bilong ol 'layers', 'circuit structure', na ol 'dimensions'.

Q: Yu ken givim ol sampela samting?

A: Ol i sapotim ol R&D sempel na liklik-batch trial prodaksen.

Q: Wanem em i minimam namba bilong oda?

A: I no gat strongpela MOQ limit bilong ol standet prodak; em i dipen long ol spesifikesen bilong prodak.

Q: Hamas taim bilong prodak i stap?

A: Ol sempol i save kisim 3-4 wik, na ol bikpela oda i save kisim 4-6 wik.

Q: Wanem ol tred tok ol i sapotim?

A: EXW, FOB, CIF, DDP, na ol narapela intanesenel tred rot i gat sapot.

Q: Hau bai yu mekim ol 'batch' i stap wankain?

A: Mipela i save mekim gut ol prodak saplai long rot bilong standet proses menesmen na ful-proses kwaliti kontrol.

Q: Wanem ol indastri ol i save yusim ol prodak bilong yu long en?

A: Ol i save yusim planti long 5G komyunikesen, otomotiv ilektroniks, aerospace, indastriel elektroniks, na ol sensa.

Q: Man i wokim dispela samting i save sapotim ol OEM/ODM projek?

A: Mipela i sapotim ol sevis we ol i wokim long laik bilong ol yet stat long R&D disain i go inap long bikpela prodaksen deliveri.

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