Low Temperature Co-fired Ceramic
Diskripsen
Teknikel Paramita
Prodak Introdaksen
Low Temperature Co-fired Ceramic em i wanpela gutpela ilektronik seramik samting we ol i wokim long rot bilong 'ceramic green tape casting', 'conductor circuit printing', 'multilayer lamination', na 'single co-firing long tempereja aninit long 900 digri.
Ol bikpela gutpela samting
Liklik Dielektrik Lus
LTCC i gat liklik 'dielectric constant' na 'dielectric loss', na dispela i save daunim tru 'high-frequency signal atenuation na crosstalk, na i save mekim signal i kamap gutpela moa.
Strongpela Multilayer Integresen Kepabiliti
LTCC i sapotim wok bilong putim ol 'resistor', 'capacitor', 'inductor', na ol 'complex conductor lines', na dispela i mekim na ol i ken wokim tripela 'dimensional circuit'.
Gutpela 'Thermal Stability'
Dispela samting i gat liklik 'coefficient' bilong 'thermal expansion' na gutpela 'dimensional stability', na dispela i larim em long sanap strong longpela taim long 'high' na 'low tempereture cycling'.
LTCC egensim ol narapela samting
|
Banis |
LTCC |
HTCC |
PCB |
|
Tempereja bilong paia |
<900 digri |
>1600 digri |
- |
|
Hai Frikwensi Pefomens |
Nambawan |
Gutpela |
I no bikpela |
|
Dielectric Loss |
Daunbilo |
Midium |
Hai |
|
Stap bilong hat |
Nambawan |
Nambawan |
I no bikpela |
|
Miniaturisesen |
Nambawan |
Gutpela |
Limited |
|
Ol Komponen we i stap insait |
Yes |
Limited |
Nogat |
|
Signal Integrity |
Nambawan |
Gutpela |
I no bikpela |
Teknikel Spesifikasen
|
Samting |
Tipikel veliu |
|
Kain samting |
LTCC Seramik |
|
Dielectric Constant (Dk) |
5.5–10 |
|
Dielectric Loss (tanδ) |
0.001–0.003 |
|
Thermal Conductivity |
3–5 W/m·K |
|
CTE |
5.8–7.2 ×10⁻⁶/K |
|
Kaun bilong ol leia |
I go inap long 40+ Leya |
|
Min. Lain Width/Spesing |
Liklik o wankain olsem 50 μm / 50 μm |
|
Min. Long rot bilong Diamita |
Bikpela o wankain olsem 75 μm |
|
Metalisasen |
Ag / Au / Cu |
|
Strong bilong tanim |
Bikpela o wankain olsem 230 MPa |
|
Tempereja bilong wok |
-65 digri i go long +250 digri |
|
Raf bilong pes |
Liklik o wankain olsem 0.3 μm |
|
Ol sais |
Kastom |
Ol sevis bilong stretim ol samting
Material System Customization:Sapotim disain bilong ol samting wantaim ol narapela narapela 'dielectric constants', 'thermal conductivity', na 'coefficients of thermal expansion'.
Multilayer Stracture Customization:Sapotim divelopmen bilong ol kain kain namba bilong ol leia, tiknes, na ol kompleks 3D waia straksa.
Metalisasen Solusen Kastomaisesen:Em i save givim ol 'conductor' sistem olsem Ag, Au, na Cu, na tu ol rot bilong stretim 'surface'.
RF Pefomens Optimaisesen:Kolaboretiv disain we i kamap long operesen frikwensi, ol lus rikwaemen, na aplikesen envairomen.
OEM/ODM Divelopmen:Sapotim wanpela-stop sevis stat long makim ol samting, disain bilong straksa, divelopmen bilong sampela samting i go inap long kamapim planti samting.
Ol aplikesen
5G Komyunikesen:Ol i save yusim long ol 'base station antennas', RF fran-en, na ol milimita-wev komunikesen modul.
Reda bilong ol kar:Ol i yusim long 77GHz otomotiv milimita-wev reda paket na antena sistem.
Ol GPS Antena:Ol i save yusim long 'navigation', 'positioning', na ol samting bilong toktok long satelit.
IoT Divais:Em i gutpela long ol 'wireless communication terminals' we i gat planti 'integrated'.
Aerospace Electronics:I inapim ol samting we ol i laikim long ol 'high-reliability aerospace electronic systems.
Ol Indastrial Sensa:Em i gutpela long ol indastriel otomesen na ol gutpela sensing sistem.
Kwaliti Asurens
Sekim ol Raw Material:Ol i save mekim strongpela wok painimaut long 'purity', sais bilong ol liklik hap samting, na ol bikpela samting bilong ol 'raw materials'.
Proses Kwaliti Kontrol:Ol i save mekim 'online monitoring' na 'data traceability' long ol bikpela wok bilong mekim wok i stap gut.
Verifikasen bilong gutpela bilong prodak i pinis:Ol i save mekim 'dielectric performance', 'high' na low temperature cycling', 'thermal shock', 'X-ray', na 'airtightness testing' bilong lukim olsem prodak i wok gut longpela taim.
Strong bilong kampani
20+ Yia Ekspiriens long Wokim Samting
Ol i bin kirapim long 2003, na ol i save wok long R&D na wokim ol nupela samting we i no gat laip, na ol i gat moa long 20 yia ekspiriens long indastri.
Stebol Prodaksen Kapabiliti
I gat bikpela-skel prodaksen beis na wanpela gutpela sistem bilong wokim ol samting, na i sapotim longpela taim stebol prokiumen long ol global klaien.
Profesenel R&D Tim
I gat ol samting bilong R&D na wok bilong mekim gutpela wok, na i givim ol gutpela rot bilong stretim hevi.
Strongpela Kwaliti Kontrol
I gat ol gutpela masin bilong testim, na i bosim gut kwaliti bilong prodak na stebiliti bilong ol samting.
Global Ekspot Ekspiriens
Ol i save salim ol prodak i go long ol ovasis maket, wantaim ol gutpela sevis bilong salim ol samting i go aut na ol gutpela rot bilong sapotim ol kastoma.
Ol Solusen we ol i wokim long laik bilong ol yet
Sapotim wok bilong stretim ol spesifikasen bilong prodak, pefomens, na ol aplikesen rikwaemen bilong inapim ol kain kain nid bilong ol kastoma.
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